International Patent: NICKEL PLATING FILM, ELECTROLESS NICKEL PLATING SOLUTION, AND ELECTROLESS PLATING METHOD

GENEVA, Aug. 14 -- KANAGAWA UNIVERSITY filed a patent application (JP2026/003713) for “NICKEL PLATING FILM, ELECTROLESS NICKEL PLATING SOLUTION, AND ELECTROLESS PLATING METHOD”. With publication no. WO/2026/168401, here are the other details related to the patent application:

Kind: Initial Publication with ISR [A1]

IPC: C23C 18/34

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

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