INTERNATIONAL PATENT: NEXPERIA B.V., NEXPERIA TECHNOLOGY (SHANGHAI) LTD. FILES APPLICATION FOR "A POWER PACKAGE COMPRISING AN AUXILIARY SUBSTRATE"

GENEVA, April 17 -- NEXPERIA B.V. (Jonkerbosplein 52, 6534 AB, Nijmegen), NEXPERIA TECHNOLOGY (SHANGHAI) LTD. (Room 201, No. 458 Jumen RoadHuangpu District, Shanghai 200025) filed a patent application (PCT/CN2024/123374) for "A POWER PACKAGE COMPRISING AN AUXILIARY SUBSTRATE" on Oct 08, 2024. With publication no. WO/2026/076560, the details related to the patent application was published on Apr 16, 2026.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): CAO, Pulong (NO.501 East Yunling Rd.Putuo District, Shanghai 200062), MENG, Xiangfei (7/F, Building 18E, 18 Science Park East Avenue, Hong Kong Scie...