INTERNATIONAL PATENT: NEXPERIA B.V., NEXPERIA TECHNOLOGY (SHANGHAI) LTD. FILES APPLICATION FOR "A METHOD FOR MANUFACTURING A SEMICONDUCTOR POWER PACKAGE AS WELL AS SUCH SEMICONDUCTOR POWER PACKAGE COMPRISING AT LEAST ONE SEMICONDUCTOR DEVICE"

GENEVA, May 3 -- NEXPERIA B.V. (Jonkerbosplein 52, 6534 AB, Nijmegen), NEXPERIA TECHNOLOGY (SHANGHAI) LTD. (Room 201, No. 458 Jumen RoadHuangpu District, Shanghai 200025) filed a patent application (PCT/CN2024/126041) for "A METHOD FOR MANUFACTURING A SEMICONDUCTOR POWER PACKAGE AS WELL AS SUCH SEMICONDUCTOR POWER PACKAGE COMPRISING AT LEAST ONE SEMICONDUCTOR DEVICE" on Oct 21, 2024. With publication no. WO/2026/085652, the details related to the patent application was published on Apr 30, 2026.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): YUAN, Zhihui (Putzbrunner Str. 7181739 Munich), GONG, W...