INTERNATIONAL PATENT: NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGY, 国立研究開発法人産業技術総合研究所 FILES APPLICATION FOR "CUTTING DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR WAFER USING SAME"

GENEVA, March 3 -- NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGY (3-1, Kasumigaseki 1-chome, Chiyoda-ku, Tokyo1008921), 国立研究開発法人産業技術総合研究所 (東京都千代田区霞が関１丁目３番１号) filed a patent application (PCT/JP2025/027472) for "CUTTING DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR WAFER USING SAME" on Aug 04, 2025. With publication no. WO/2026/042543, the details related to the patent application was published on Feb 26, 2026.

Notably, the patent application was submitted under the International Paten...