INTERNATIONAL PATENT: NATIONAL CENTER FOR ADVANCED PACKAGING CO., LTD., 华进半导体封装先导技术研发中心有限公司 FILES APPLICATION FOR "THROUGH-SILICON VIA ADAPTER BOARD STRUCTURE AND MANUFACTURING METHOD THEREFOR"

Posted On: 2025-06-02

GENEVA, June 2 -- NATIONAL CENTER FOR ADVANCED PACKAGING CO., LTD. (Building D1, China Sensor Network International Innovation Park, 200 Linghu Boulevard, Taihu International Tech-Park, Xinwu District,Wuxi, Jiangsu 214135), 华进半导体封装先导技术研发中心有限公司 (中国江苏省无锡市新吴区太湖国际科技园菱湖大道200号中国传感网国际创新园D1栋) filed a patent application (PCT/CN2024/105745) for "THROUGH-SILICON VIA ADAPTER BOARD STRUCTU...

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INTERNATIONAL PATENT: NATIONAL CENTER FOR ADVANCED PACKAGING CO., LTD., 华进半导体封装先导技术研发中心有限公司 FILES APPLICATION FOR "THROUGH-SILICON VIA ADAPTER BOARD STRUCTURE AND MANUFACTURING METHOD THEREFOR"