GENEVA, Sept. 24 -- HTMS (DTC IP) LIMITED filed a patent application (IB2026/000367) for “NANOPARTICLE COOLANT ADDITIVE FOR DIRECT-TO-CHIP COOLING”. With publication no. WO/2026/196065, here are the other details related to the patent application:
Kind: Initial Publication without ISR [A2]
IPC: none
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
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