INTERNATIONAL PATENT: NAMICS CORPORATION, ナミックス株式会社 FILES APPLICATION FOR "RESIN COMPOSITION AND INSULATING ADHESIVE FILM, MULTILAYER SUBSTRATE, ELECTRONIC COMPONENT AND SEMICONDUCTOR DEVICE EACH USING SAME"

GENEVA, March 18 -- NAMICS CORPORATION (3993, Nigorikawa, Kita-ku, Niigata-shi, Niigata9503131), ナミックス株式会社 (新潟県新潟市北区濁川３９９３番地) filed a patent application (PCT/JP2025/031369) for "RESIN COMPOSITION, AND INSULATING ADHESIVE FILM, MULTILAYER SUBSTRATE, ELECTRONIC COMPONENT, AND SEMICONDUCTOR DEVICE EACH USING SAME" on Sep 04, 2025. With publication no. WO/2026/054034, the details related to the patent application was published on Mar 12, 2026.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the ...