INTERNATIONAL PATENT: NAMICS CORPORATION, ナミックス株式会社 FILES APPLICATION FOR "PHOTOCURABLE RESIN COMPOSITION, ADHESIVE, SEALANT, COATING AGENT, CURED PRODUCT, SEMICONDUCTOR DEVICE, ELECTRONIC COMPONENT AND CURING, BONDING, SEALING AND COATING METHODS USING PHOTOCURABLE RESIN COMPOSITION"

GENEVA, Feb. 3 -- NAMICS CORPORATION (3993, Nigorikawa, Kita-ku, Niigata-shi, Niigata9503131), ナミックス株式会社 (新潟県新潟市北区濁川３９９３番地) filed a patent application (PCT/JP2025/022793) for "PHOTOCURABLE RESIN COMPOSITION, ADHESIVE, SEALANT, COATING AGENT, CURED PRODUCT, SEMICONDUCTOR DEVICE, ELECTRONIC COMPONENT, AND CURING, BONDING, SEALING, AND COATING METHODS USING PHOTOCURABLE RESIN COMPOSITION" on Jun 25, 2025. With publication no. WO/2026/023321, the details related to the patent application was published on Jan 29, 2026.

Notably, the patent application was submitted under th...