INTERNATIONAL PATENT: NAMICS CORPORATION, ナミックス株式会社 FILES APPLICATION FOR "LIQUID COMPRESSION MOLDING MATERIAL, CURED PRODUCT, ELECTRONIC COMPONENT AND SEMICONDUCTOR DEVICE"

GENEVA, May 19 -- NAMICS CORPORATION (3993, Nigorikawa, Kita-ku, Niigata-shi, Niigata9503131), ナミックス株式会社 (新潟県新潟市北区濁川３９９３番地) filed a patent application (PCT/JP2025/033989) for "LIQUID COMPRESSION MOLDING MATERIAL, CURED PRODUCT, ELECTRONIC COMPONENT, AND SEMICONDUCTOR DEVICE" on Sep 26, 2025. With publication no. WO/2026/100236, the details related to the patent application was published on May 15, 2026.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organizat...