INTERNATIONAL PATENT: MURATA MANUFACTURING CO., LTD., 株式会社村田製作所 FILES APPLICATION FOR "ELECTRONIC COMPONENT INTEGRATED MODULE, SUBSTRATE WITH BUILT-IN MODULE AND METHOD FOR MANUFACTURING ELECTRONIC COMPONENT INTEGRATED MODULE"

GENEVA, Jan. 13 -- MURATA MANUFACTURING CO., LTD. (10-1, Higashikotari 1-chome, Nagaokakyo-shi, Kyoto6178555), 株式会社村田製作所 (京都府長岡京市東神足１丁目１０番１号) filed a patent application (PCT/JP2025/017164) for "ELECTRONIC COMPONENT INTEGRATED MODULE, SUBSTRATE WITH BUILT-IN MODULE, AND METHOD FOR MANUFACTURING ELECTRONIC COMPONENT INTEGRATED MODULE" on May 12, 2025. With publication no. WO/2026/009567, the details related to the patent application was published on Jan 08, 2026.

Notably, the patent application was submitted under the International Patent Classification (I...