GENEVA, July 1 -- ATLANT 3D, APS filed a patent application (US2025/059451) for “MULTIPLE FLOW NOZZLE FOR DIRECT ATOMIC LAYER DEPOSITION AND USES THEREOF”. With publication no. WO/2026/128836, here are the other details related to the patent application:

Kind: Initial Publication with ISR [A1]

IPC: C23C 16/455

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

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