GENEVA, Aug. 21 -- FUSION PACKAGING I, LLC filed a patent application (US2026/015429) for “MULTI-VALVE LIQUID DISPENSER ASSEMBLY”. With publication no. WO/2026/174282, here are the other details related to the patent application:
Kind: Initial Publication with ISR [A1]
IPC: B65D 47/20
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
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