GENEVA, Sept. 18 -- CHENGDU LAMDA TECHNOLOGY CO., LTD filed a patent application (CN2025/120613) for “MULTI-PORT MULTI-BAND INTERMODULATION TESTING METHOD AND DEVICE”. With publication no. WO/2026/184050, here are the other details related to the patent application:
Kind: Initial Publication with ISR [A1]
IPC: H04B 17/00
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
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