GENEVA, Nov. 6 -- QUALCOMM INCORPORATED filed a patent application (US2026/024581) for “MULTI-MODAL FOUNDATIONAL MODEL AND WORLD MODEL BASED END-TO-END VEHICLE ARCHITECTURE”. With publication no. WO/2026/231425, here are the other details related to the patent application:

Kind: Initial Publication with ISR [A1]

IPC: G06V 20/56

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

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