GENEVA, Aug. 14 -- IN, Pildoo filed a patent application (KR2026/002095) for “MULTI-LEVEL SALES COMPENSATION SYSTEM USING CHAINARY STRUCTURE, AND METHOD THEREOF”. With publication no. WO/2026/168980, here are the other details related to the patent application:
Kind: Initial Publication with ISR [A1]
IPC: G06Q 30/02
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
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