GENEVA, July 2 -- QUALCOMM INCORPORATED filed a patent application (US2025/057226) for “MULTI-LAYER SPARSE CONTENT HANDLING FOR SPLIT AR/MR”. With publication no. WO/2026/135961, here are the other details related to the patent application:

Kind: Initial Publication with ISR [A1]

IPC: G06T 15/00

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Disclaimer: Curated by HT Syndication....