GENEVA, Nov. 6 -- RAYTHEON COMPANY filed a patent application (US2026/024665) for “MULTI-LAYER RADIO FREQUENCY (RF) INTERPOSERS WITH FINE LINE LAYERING”. With publication no. WO/2026/231433, here are the other details related to the patent application:
Kind: Initial Publication with ISR [A1]
IPC: H10W 44/20
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
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