GENEVA, July 9 -- SMART PACKAGING SOLUTIONS filed a patent application (EP2025/088923) for “MULTI-CHIP MODULE FOR A CHIP-CONTAINING DOCUMENT AND CORRESPONDING CHIP-CONTAINING DOCUMENT”. With publication no. WO/2026/146080, here are the other details related to the patent application:
Kind: Initial Publication with ISR [A1]
IPC: G06K 19/07
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
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