International Patent: MULTI-CHIP MODULE, DEVICE, DATA CENTER, AND METHOD FOR MANUFACTURING MULTI-CHIP MODULE

GENEVA, Oct. 5 -- NTT, INC. filed a patent application (JP2025/011758) for “MULTI-CHIP MODULE, DEVICE, DATA CENTER, AND METHOD FOR MANUFACTURING MULTI-CHIP MODULE”. With publication no. WO/2026/203053, here are the other details related to the patent application:

Kind: Initial Publication with ISR [A1]

IPC: G02B 6/42

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

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