International Patent: MOVABLE CONTACT BRIDGE ASSEMBLY, RELAY, POWER SUPPLY MODULE, ELECTRICAL DEVICE, AND POWER SUPPLY SYSTEM

GENEVA, July 9 -- HUAWEI TECHNOLOGIES CO., LTD. filed a patent application (CN2025/145818) for “MOVABLE CONTACT BRIDGE ASSEMBLY, RELAY, POWER SUPPLY MODULE, ELECTRICAL DEVICE, AND POWER SUPPLY SYSTEM”. With publication no. WO/2026/145280, here are the other details related to the patent application:

Kind: Initial Publication with ISR [A1]

IPC: H01H 50/54

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

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