GENEVA, Oct. 5 -- CUNOVA GMBH filed a patent application (DE2026/100385) for “MOULD BODY ASSEMBLY AND METHOD FOR PRODUCING A MOULD BODY ASSEMBLY”. With publication no. WO/2026/201275, here are the other details related to the patent application:
Kind: Initial Publication with ISR [A1]
IPC: B22D 11/055
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
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