INTERNATIONAL PATENT: MOLD-RITE PLASTICS, LLC FILES APPLICATION FOR "RFID INLAY ASSEMBLY AND CLOSURE CONTAINING SAME"

GENEVA, Jan. 20 -- MOLD-RITE PLASTICS, LLC (2222 Highland RoadTwinsburg, Ohio 44087) filed a patent application (PCT/US2025/036256) for "RFID INLAY ASSEMBLY AND CLOSURE CONTAINING SAME" on Jul 02, 2025. With publication no. WO/2026/015350, the details related to the patent application was published on Jan 15, 2026.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): HUNT, Gareth (593 West Shore RoadSouth Hero, Vermont 05486)

Abstract: An RFID Inlay for mounting to closure for a container. The RFID inlay includes a nonconductive substrate with a first induction heating annular ring located on the subs...