International Patent: MODULE ENCLOSURE FOR THERMAL RUNAWAY CONTAINMENT WITH MINIMAL MASS AND MANUFACTURING EASE

GENEVA, Sept. 24 -- WISK AERO LLC filed a patent application (US2026/020158) for “MODULE ENCLOSURE FOR THERMAL RUNAWAY CONTAINMENT WITH MINIMAL MASS AND MANUFACTURING EASE”. With publication no. WO/2026/198911, here are the other details related to the patent application:

Kind: Initial Publication with ISR [A1]

IPC: H01M 10/60

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Disclaimer: Curated by HT Syndication....