GENEVA, Sept. 24 -- TERAVILA INC. filed a patent application (US2026/019466) for “MODULAR MOLDING INFRASTRUCTURE FOR CONSTRUCTING HOUSING UNITS”. With publication no. WO/2026/198491, here are the other details related to the patent application:
Kind: Initial Publication with ISR [A1]
IPC: E04B 2/84
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
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