International Patent: MODULAR FRAMEWORK SUBSTRUCTURES WITH INTERLOCKING FEATURES, RELATED SUBASSEMBLIES, STRUCTURES, SYSTEMS AND METHODS

GENEVA, Sept. 18 -- NGUYEN, Tuyen Vinh filed a patent application (US2026/016920) for “MODULAR FRAMEWORK SUBSTRUCTURES WITH INTERLOCKING FEATURES, RELATED SUBASSEMBLIES, STRUCTURES, SYSTEMS AND METHODS”. With publication no. WO/2026/187585, here are the other details related to the patent application:

Kind: Initial Publication with ISR [A1]

IPC: E04B 1/348

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

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