International Patent: MODIFIED EPOXIDIZED POLYBUTADIENE-CONTAINING BUILD-UP FILM FOR FC-BGA PACKAGING SUBSTRATE, PREPARATION METHOD THEREFOR AND USE THEREOF

GENEVA, June 26 -- SHENZHEN NEWFILMS NEW MATERIAL TECHNOLOGY CO., LTD. filed a patent application (CN2025/111570) for “MODIFIED EPOXIDIZED POLYBUTADIENE-CONTAINING BUILD-UP FILM FOR FC-BGA PACKAGING SUBSTRATE, PREPARATION METHOD THEREFOR AND USE THEREOF”. With publication no. WO/2026/118494, here are the other details related to the patent application:

Kind: Initial Publication with ISR [A1]

IPC: C09J 163/00

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

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