INTERNATIONAL PATENT: MITSUBISHI GAS CHEMICAL COMPANY, INC., 三菱瓦斯化学株式会社 FILES APPLICATION FOR "AQUEOUS COMPOSITION FOR COPPER ETCHING AND ETCHING METHOD AND METHOD FOR PRODUCING SUBSTRATE FOR SEMICONDUCTOR PACKAGE USING SAME"

GENEVA, March 10 -- MITSUBISHI GAS CHEMICAL COMPANY, INC. (5-2, Marunouchi 2-chome, Chiyoda-ku, Tokyo1008324), 三菱瓦斯化学株式会社 (東京都千代田区丸の内二丁目５番２号) filed a patent application (PCT/JP2025/029148) for "AQUEOUS COMPOSITION FOR COPPER ETCHING, AND ETCHING METHOD AND METHOD FOR PRODUCING SUBSTRATE FOR SEMICONDUCTOR PACKAGE USING SAME" on Aug 20, 2025. With publication no. WO/2026/048616, the details related to the patent application was published on Mar 05, 2026.

Notably, the patent application was submitted under the International Patent Classification (IPC) syste...