INTERNATIONAL PATENT: MITSUBISHI ELECTRIC CORPORATION, 三菱電機株式会社 FILES APPLICATION FOR "THIN FILM STRESS MEASUREMENT METHOD, SUBSTRATE FOR THIN FILM STRESS MEASUREMENT, DEVICE PRODUCTION METHOD USING SAME AND THIN FILM STRESS MEASUREMENT DEVICE"

GENEVA, March 17 -- MITSUBISHI ELECTRIC CORPORATION (7-3, Marunouchi 2-chome, Chiyoda-ku, Tokyo1008310), 三菱電機株式会社 (東京都千代田区丸の内二丁目７番３号) filed a patent application (PCT/JP2024/045855) for "THIN FILM STRESS MEASUREMENT METHOD, SUBSTRATE FOR THIN FILM STRESS MEASUREMENT, DEVICE PRODUCTION METHOD USING SAME, AND THIN FILM STRESS MEASUREMENT DEVICE" on Dec 25, 2024. With publication no. WO/2026/053455, the details related to the patent application was published on Mar 12, 2026.

Notably, the patent application was submitted under the International Patent Classification (IPC) ...