INTERNATIONAL PATENT: MIRALEX TECHNOLOGIES FILES APPLICATION FOR "WALL ASSEMBLY WITH IMPROVED THERMAL INSULATION PROPERTIES"

GENEVA, April 13 -- MIRALEX TECHNOLOGIES (279 ch. FlemingCantley, Quebec J8V 3B4) filed a patent application (PCT/CA2024/051316) for "WALL ASSEMBLY WITH IMPROVED THERMAL INSULATION PROPERTIES" on Oct 04, 2024. With publication no. WO/2026/073333, the details related to the patent application was published on Apr 09, 2026.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): COELHO, Jean-Claude (279, chemin FlemingCantley, Quebec J8V 3B4)

Abstract: A wall including a thermal chamber assembly having a radiant panel layer, a thermal generation system connected to the radiant panel layer, a first insulati...