INTERNATIONAL PATENT: MICRON TECHNOLOGY, INC. FILES APPLICATION FOR "THREE-DIMENSIONAL MEMORY STRUCTURES AND RELATED METHODS OF OPERATION AND CONSTRUCTION"

GENEVA, Feb. 11 -- MICRON TECHNOLOGY, INC. (8000 So. Federal WayBoise, Idaho 83716-9632) filed a patent application (PCT/US2025/038599) for "THREE-DIMENSIONAL MEMORY STRUCTURES, AND RELATED METHODS OF OPERATION AND CONSTRUCTION" on Jul 22, 2025. With publication no. WO/2026/030038, the details related to the patent application was published on Feb 05, 2026.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): VORA, Nirav (5967 W Daphne Dr.Meridian, Idaho 83646), ZHAO, Zhao (2169 S Hills AveMeridian, Idaho 83642)

Abstract: Memory devices, such as three-dimensional cross-point memory devices, and method...