INTERNATIONAL PATENT: MICRON TECHNOLOGY, INC. FILES APPLICATION FOR "THREE-DIMENSIONAL CLEAVAGE TECHNIQUES USING STEALTH DICING AND ASSOCIATED SYSTEMS AND METHODS"

GENEVA, Jan. 13 -- MICRON TECHNOLOGY, INC. (8000 S. Federal Way, P.O. Box 6Boise, ID 83707-0006) filed a patent application (PCT/US2025/033849) for "THREE-DIMENSIONAL CLEAVAGE TECHNIQUES USING STEALTH DICING, AND ASSOCIATED SYSTEMS AND METHODS" on Jun 16, 2025. With publication no. WO/2026/010728, the details related to the patent application was published on Jan 08, 2026.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): KIRBY, Kyle, K. (c/o Micron Technology, Inc.8000 S. Federal Way, P.O. Box 6Boise, ID 83707-0006), BAYLESS, Andrew, M. (c/o Micron Technology, Inc.8000 S. Federal Way, P.O. Box 6Boi...