INTERNATIONAL PATENT: MICRON TECHNOLOGY, INC. FILES APPLICATION FOR "THERMAL STRUCTURES FOR HYBRID BONDING"

GENEVA, Feb. 11 -- MICRON TECHNOLOGY, INC. (8000 S. Federal WayBoise, Idaho 83716-9632) filed a patent application (PCT/US2025/038956) for "THERMAL STRUCTURES FOR HYBRID BONDING" on Jul 23, 2025. With publication no. WO/2026/030087, the details related to the patent application was published on Feb 05, 2026.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): BHUSHAN, Bharat (8000 S. Federal WayBoise, Idaho 83716-9632), GRIFFIN, Amy Rae (8000 S. Federal WayBoise, Idaho 83716-9632), DOEBLER, Jonathan Thomas (8000 S. Federal WayBoise, Idaho 83716-9632), TIGUE, Angela (8000 S. Federal WayBoise, Idaho 837...