INTERNATIONAL PATENT: MICRON TECHNOLOGY, INC. FILES APPLICATION FOR "SEMICONDUCTOR DIE RELEASING WITHIN CARRIER WAFER"

GENEVA, Jan. 27 -- MICRON TECHNOLOGY, INC. (8000 S. Federal Way, P.O. Box 6Boise, ID 83707-0006) filed a patent application (PCT/US2025/037815) for "SEMICONDUCTOR DIE RELEASING WITHIN CARRIER WAFER" on Jul 16, 2025. With publication no. WO/2026/019864, the details related to the patent application was published on Jan 22, 2026.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): YEDURU, Srinivasa, Reddy (c/o Micron Technology, Inc.8000 S. Federal Way, P.O. Box 6Boise, ID 83707-0006), GOOD, Farrell, M. (c/o Micron Technology, Inc.8000 S. Federal Way, P.O. Box 6Boise, ID 83707-0006), THORUM, Matthew (c/...