INTERNATIONAL PATENT: MICRON TECHNOLOGY, INC. FILES APPLICATION FOR "SEMICONDUCTOR DEVICE WITH BACKSIDE INTERFACE MECHANISM AND METHODS FOR MANUFACTURING THE SAME"

GENEVA, Oct. 20 -- MICRON TECHNOLOGY, INC. (8000 S. Federal WayP.O. Box 6Boise, ID 83707-0006) filed a patent application (PCT/US2025/023525) for "SEMICONDUCTOR DEVICE WITH BACKSIDE INTERFACE MECHANISM AND METHODS FOR MANUFACTURING THE SAME" on Apr 07, 2025. With publication no. WO/2025/217083, the details related to the patent application was published on Oct 16, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): BHUSHAN, Bharat (c/o Micron Technology, Inc.8000 S. Federal WayP.O. Box 6Boise, ID 83707-0006), BENNETT, Jonathan A. (c/o Micron Technology, Inc.8000 S. Federal WayP.O. Box 6Boise, ID...