INTERNATIONAL PATENT: MICRON TECHNOLOGY, INC. FILES APPLICATION FOR "SEMICONDUCTOR DEVICE WITH A TWO-SIDED REDISTRIBUTION LAYER"

GENEVA, Jan. 27 -- MICRON TECHNOLOGY, INC. (8000 S. Federal WayP.O. Box 6Boise, ID 83707-0006) filed a patent application (PCT/US2025/037974) for "SEMICONDUCTOR DEVICE WITH A TWO-SIDED REDISTRIBUTION LAYER" on Jul 16, 2025. With publication no. WO/2026/019967, the details related to the patent application was published on Jan 22, 2026.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): JUNG, Yeon, Seung (c/o Micron Technology, Inc.8000 S. Federal WayP.O. Box 6Boise, ID 83707-0006)

Abstract: A semiconductor device with a two-sided redistribution layer is disclosed. The semiconductor device comprises ...