GENEVA, Jan. 20 -- MICRON TECHNOLOGY, INC. (8000 S. Federal Way, P.O. Box 6Boise, ID 83707-0006) filed a patent application (PCT/US2025/035810) for "SEMICONDUCTOR DEVICE ASSEMBLIES WITH DISCRETE MEMORY ARRAYS AND CMOS DEVICES CONFIGURED FOR EXTERNAL CONNECTION" on Jun 27, 2025. With publication no. WO/2026/015312, the details related to the patent application was published on Jan 15, 2026.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
Inventor(s): YIP, Aaron, S. (c/o Micron Technology, Inc.8000 S. Federal Way, P.O. Box 6Boise, ID 83707-0006), PAREKH, Kunal, R. (c/o Micron Technology, Inc.8000 S. Federal Way,...