INTERNATIONAL PATENT: MICRON TECHNOLOGY, INC. FILES APPLICATION FOR "POLYMER MATERIAL GAP-FILL WITH ELECTRICAL CONNECTIONS FOR HYBRID BONDING IN A STACKED SEMICONDUCTOR SYSTEM"

GENEVA, Jan. 27 -- MICRON TECHNOLOGY, INC. (8000 S. Federal WayBoise, ID 83716-9632) filed a patent application (PCT/US2025/038153) for "POLYMER MATERIAL GAP-FILL WITH ELECTRICAL CONNECTIONS FOR HYBRID BONDING IN A STACKED SEMICONDUCTOR SYSTEM" on Jul 17, 2025. With publication no. WO/2026/020053, the details related to the patent application was published on Jan 22, 2026.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): ZHOU, Wei (8000 S. Federal WayBoise, ID 83716-9632)

Abstract: Methods, systems, and devices for a stacked semiconductor system are described. The stacked semiconductor system may ...