INTERNATIONAL PATENT: MICRON TECHNOLOGY, INC. FILES APPLICATION FOR "ON-DIE HEATING DURING MEMORY DIE OPERATION"

GENEVA, Dec. 2 -- MICRON TECHNOLOGY, INC. (8000 S. Federal WayBoise, Idaho 83716-9632) filed a patent application (PCT/US2025/029607) for "ON-DIE HEATING DURING MEMORY DIE OPERATION" on May 15, 2025. With publication no. WO/2025/244929, the details related to the patent application was published on Nov 27, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): LIM, Ken Choong (8000 S. Federal WayBoise, Idaho 83716-9632), TAN, Jun (8000 S. Federal WayBoise, Idaho 83716-9632)

Abstract: Methods, systems, and devices for on-die heating during memory die operation are described. A memory system may be ...