INTERNATIONAL PATENT: MICRON TECHNOLOGY, INC. FILES APPLICATION FOR "MICROELECTRONIC DEVICES WITH WORD LINE CONTACTS EXTENDING INTO A TIERED STACK HAVING PARTIALLY CONDUCTIVE LEVELS AND RELATED METHODS"

GENEVA, Feb. 10 -- MICRON TECHNOLOGY, INC. (8000 South Federal Way, Mailstop 1-507Boise, Idaho 83707-0006) filed a patent application (PCT/US2025/037423) for "MICROELECTRONIC DEVICES WITH WORD LINE CONTACTS EXTENDING INTO A TIERED STACK HAVING PARTIALLY CONDUCTIVE LEVELS, AND RELATED METHODS" on Jul 11, 2025. With publication no. WO/2026/029957, the details related to the patent application was published on Feb 05, 2026.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): CONTI, Anna Maria (Via Piccinni, 5MI 20131 Milano), MAZZONE, Giovanni (Viale della Vittoria, 7MB 20852 Villasanta), TESSARIOL, Paol...