INTERNATIONAL PATENT: MICRON TECHNOLOGY, INC. FILES APPLICATION FOR "METHOD OF FORMING STACKED SEMICONDUCTOR DEVICES WITH CARBON NANOFIBER STRUCTURES AND ASSOCIATED SYSTEMS AND METHODS"

GENEVA, Dec. 2 -- MICRON TECHNOLOGY, INC. (8000 S. Federal Way, P.O. Box 6Boise, ID 83707-0006) filed a patent application (PCT/US2025/030258) for "METHOD OF FORMING STACKED SEMICONDUCTOR DEVICES WITH CARBON NANOFIBER STRUCTURES AND ASSOCIATED SYSTEMS AND METHODS" on May 20, 2025. With publication no. WO/2025/245156, the details related to the patent application was published on Nov 27, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): ZHOU, Wei (c/o Micron Technology, Inc.8000 S. Federal Way, P.O. Box 6Boise, ID 83707-0006)

Abstract: Systems and methods for manufacturing stacked semiconducto...