INTERNATIONAL PATENT: MICRON TECHNOLOGY, INC. FILES APPLICATION FOR "MEMORY IN PACKAGE DEVICES AND ASSOCIATED SYSTEMS AND METHODS"

GENEVA, Jan. 20 -- MICRON TECHNOLOGY, INC. (8000 S. Federal Way, P.O. Box 6Boise, ID 83707-0006) filed a patent application (PCT/US2025/036463) for "MEMORY IN PACKAGE DEVICES AND ASSOCIATED SYSTEMS AND METHODS" on Jul 03, 2025. With publication no. WO/2026/015391, the details related to the patent application was published on Jan 15, 2026.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): AYYAPUREDDI, Sujeet (C/o Micron Technology, Inc.8000 S. Federal Way, P.O. Box 6Boise, ID 83707-0006)

Abstract: Memory-in-package (MiP) devices and associated systems and methods are disclosed. A MiP device include...