GENEVA, Dec. 24 -- MICRON TECHNOLOGY, INC. (8000 S. Federal WayBoise, Idaho 83716-9632) filed a patent application (PCT/US2025/032895) for "INTERPOSERS FOR DOUBLE-SIDED MEMORY BONDING" on Jun 09, 2025. With publication no. WO/2025/259609, the details related to the patent application was published on Dec 18, 2025.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
Inventor(s): JUNG, Yeonseung (8000 S. Federal WayBoise, Idaho 83716-9632)
Abstract: Methods, systems, and devices for interposers for double-sided memory bonding are described. A semiconductor system may implement stacks of memory dies on two sides of ...