GENEVA, Dec. 2 -- MICRON TECHNOLOGY, INC. (Mail Stop 5078000 South Federal WayP.O. Box 6Boise, Idaho 83707-0006) filed a patent application (PCT/US2025/030308) for "IN TIER MULTIPLEXER" on May 21, 2025. With publication no. WO/2025/245183, the details related to the patent application was published on Nov 27, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): KARDA, Kamal M. (2547 E Red Cedar LnApt S301Boise, Idaho 83716), DAYCOCK, David A. (5346 Keybridge Dr.Boise, Idaho 83703), ZHAO, Ting (3469 N Whistler Ln.Apt. 204Boise, Idaho 83703), LIAO, Albert (1926 S Tallwood LnBoise, Idaho 83706), RAM...