INTERNATIONAL PATENT: MICRON TECHNOLOGY, INC. FILES APPLICATION FOR "DUCT STRUCTURES FOR COOLING OF MEMORY SYSTEM COMPONENTS"

GENEVA, Jan. 20 -- MICRON TECHNOLOGY, INC. (8000 S. Federal WayBoise, Idaho 83716-9632) filed a patent application (PCT/US2025/035771) for "DUCT STRUCTURES FOR COOLING OF MEMORY SYSTEM COMPONENTS" on Jun 27, 2025. With publication no. WO/2026/015309, the details related to the patent application was published on Jan 15, 2026.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): NALLAVELLI, Ramesh (8000 S. Federal WayBoise, Idaho 83716-9632), NG, Hong Wan (8000 S. Federal WayBoise, Idaho 83716-9632), ONG, Yeow Chon (8000 S. Federal WayBoise, Idaho 83716-9632)

Abstract: Methods, systems, and devices for...