INTERNATIONAL PATENT: MICRON TECHNOLOGY, INC. FILES APPLICATION FOR "DEFERRED DIE DATA REBUILDING UPON DIE FAILURE DETECTION"

GENEVA, March 8 -- MICRON TECHNOLOGY, INC. (8000 SOUTH FEDERAL WAY, BOISEIdaho 83707-0006) filed a patent application (PCT/CN2024/115553) for "DEFERRED DIE DATA REBUILDING UPON DIE FAILURE DETECTION" on Aug 29, 2024. With publication no. WO/2026/044596, the details related to the patent application was published on Mar 05, 2026.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): LI, Juane (639 Mercado Court, MilpitasCalifornia 95035), HONG, Wenchi (No. 51, Huan Road, Qingshui District, Taichung CityTaiwan 436035), WEI, Yue (18th Floor, Building 1, No. 1535, Hongmei RoadXuhui District, Shanghai 200131...