International Patent: MICRO-ELECTROMECHANICAL SYSTEM DEVICE, SUBSTRATE ASSEMBLY, PREPARATION METHOD AND ELECTRONIC APPARATUS

GENEVA, Sept. 7 -- HUAWEI TECHNOLOGIES CO., LTD. filed a patent application (CN2026/074049) for “MICRO-ELECTROMECHANICAL SYSTEM DEVICE, SUBSTRATE ASSEMBLY, PREPARATION METHOD AND ELECTRONIC APPARATUS”. With publication no. WO/2026/179518, here are the other details related to the patent application:

Kind: Initial Publication with ISR [A1]

IPC: B81B 7/02

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

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