International Patent: MGCUSB-BASED BULK THERMOELECTRIC MATERIAL AND PREPARATION METHOD THEREFOR

GENEVA, July 18 -- SHANGHAITECH UNIVERSITY filed a patent application (CN2025/132730) for “MGCUSB-BASED BULK THERMOELECTRIC MATERIAL AND PREPARATION METHOD THEREFOR”. With publication no. WO/2026/148992, here are the other details related to the patent application:

Kind: Initial Publication with ISR [A1]

IPC: C22C 12/00

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

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