International Patent: METHOD OF SPLITTING A SEMICONDUCTOR SUBSTRATE AND SUBSTRATE SPLITTING APPARATUS

GENEVA, July 2 -- INFINEON TECHNOLOGIES AG filed a patent application (EP2025/085043) for “METHOD OF SPLITTING A SEMICONDUCTOR SUBSTRATE AND SUBSTRATE SPLITTING APPARATUS”. With publication no. WO/2026/131088, here are the other details related to the patent application:

Kind: Initial Publication with ISR [A1]

IPC: B28D 5/00

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

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