International Patent: METHOD OF MANUFACTURING A CURRENT SPREADING LAYER AS WELL AS A SEMICONDUCTOR DEVICE

GENEVA, July 1 -- NEXPERIA B.V. filed a patent application (EP2025/086937) for “METHOD OF MANUFACTURING A CURRENT SPREADING LAYER AS WELL AS A SEMICONDUCTOR DEVICE”. With publication no. WO/2026/125752, here are the other details related to the patent application:

Kind: Initial Publication with ISR [A1]

IPC: H10D 30/01

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

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