GENEVA, June 19 -- CORNING INCORPORATED filed a patent application (US2025/053308) for “METHOD OF FORMING ARTICLES COMPRISING TEMPORARY BONDING OF SUBSTRATES”. With publication no. WO/2026/106804, here are the other details related to the patent application:
Kind: Initial Publication with ISR [A1]
IPC: B32B 7/12
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
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